ISBN: 9780387281537
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...
Indigo.ca new in stock. Shipping costs:zzgl. Versandkosten., plus shipping costs Details... |
ISBN: 9780387281537
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...
Springer.com Nr. 978-0-387-28153-7. Shipping costs:Worldwide free shipping, , DE. (EUR 0.00) Details... |
Integrated Circuit Packaging, Assembly and Interconnections / William Greig / Buch / Springer Series in Advanced Mi / Englisch / 2007 / SPRINGER NATURE / EAN 9780387281537 - hardcover
2007, ISBN: 9780387281537
[ED: Gebunden], [PU: SPRINGER NATURE], Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials an… More...
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2007, ISBN: 0387281533
Integrated Circuit Packaging Assembly and Interconnections ab 178.49 € als gebundene Ausgabe: Auflage 2007. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, SPRINGER NATURE
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2007, ISBN: 9780387281537
Integrated Circuit Packaging Assembly and Interconnections - Auflage 2007: ab 186.49 € Bücher > Wissenschaft > Technik SPRINGER NATURE, SPRINGER NATURE
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Integrated Circuit Packaging Assembly and Interconnections by William Greig Hardcover | Indigo Chapters - new book
ISBN: 9780387281537
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...
ISBN: 9780387281537
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as t… More...
Integrated Circuit Packaging, Assembly and Interconnections / William Greig / Buch / Springer Series in Advanced Mi / Englisch / 2007 / SPRINGER NATURE / EAN 9780387281537 - hardcover
2007
ISBN: 9780387281537
[ED: Gebunden], [PU: SPRINGER NATURE], Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials an… More...
2007, ISBN: 0387281533
Integrated Circuit Packaging Assembly and Interconnections ab 178.49 € als gebundene Ausgabe: Auflage 2007. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, SPRINGER NATURE
2007, ISBN: 9780387281537
Integrated Circuit Packaging Assembly and Interconnections - Auflage 2007: ab 186.49 € Bücher > Wissenschaft > Technik SPRINGER NATURE, SPRINGER NATURE
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Details of the book - Integrated Circuit Packaging Assembly and Interconnections by William Greig Hardcover | Indigo Chapters
EAN (ISBN-13): 9780387281537
ISBN (ISBN-10): 0387281533
Hardcover
Paperback
Publishing year: 2007
Publisher: William Greig
300 Pages
Weight: 0,662 kg
Language: eng/Englisch
Book in our database since 2007-03-01T05:21:33-05:00 (New York)
Detail page last modified on 2024-01-26T09:47:05-05:00 (New York)
ISBN/EAN: 9780387281537
ISBN - alternate spelling:
0-387-28153-3, 978-0-387-28153-7
Alternate spelling and related search-keywords:
Book author: greig, springer
Book title: options, con, interconnections, assembly, microelectronic circuit, self packaging, advanced packaging, around the circuit, microelectronics, springer, series advanced
Information from Publisher
Author: William Greig
Title: Integrated Circuit Packaging, Assembly and Interconnections
Publisher: Springer; Springer US
300 Pages
Publishing year: 2007-03-30
New York; NY; US
Language: English
106,99 € (DE)
109,99 € (AT)
118,00 CHF (CH)
Available
XXVIII, 300 p. 75 illus.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; circuit; integrated circuit; manufacturing; material; packaging; thin films; Electronics and Microelectronics, Instrumentation; Electronic Circuits and Systems; Engineering Design; Optical Materials; Schaltkreise und Komponenten (Bauteile); Konstruktion, Entwurf; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; EA; BC
Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC—Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options—Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding—TAB.- Flip Chip—The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how package trends and assembly options are impacted by the IC and its mechanical, electrical, and thermal characteristics Identifies the IC manufacturing process (Wafer Fab) as a technology resource for the manufacture of high density interconnects Highlights flip chip as the next generation first level interconnect A comprehensive glossary of terms is included Includes supplementary material: sn.pub/extras
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