Betty Prince:Vertical 3D Memory Technologies
- new book 2014, ISBN: 9781118760451
The large scale integration and planar scaling of individualsystem chips is reaching an expensive limit. If individual chipsnow, and later terrabyte memory blocks, memory macros, andproce… More...
The large scale integration and planar scaling of individualsystem chips is reaching an expensive limit. If individual chipsnow, and later terrabyte memory blocks, memory macros, andprocessing cores, can be tightly linked in optimally designed andprocessed small footprint vertical stacks, then performance can beincreased, power reduced and cost contained. This book reviews forthe electronics industry engineer, professional and student thecritical areas of development for 3D vertical memory chipsincluding: gate-all-around and junction-less nanowire memories,stacked thin film and double gate memories, terrabit verticalchannel and vertical gate stacked NAND flash, large scale stackingof Resistance RAM cross-point arrays, and 2.5D/3D stacking ofmemory and processor chips with through-silicon-via connections now and remote links later. Key features: * Presents a review of the status and trends in 3-dimensionalvertical memory chip technologies. * Extensively reviews advanced vertical memory chip technologyand development * Explores technology process routes and 3D chip integration in asingle reference Vertical 3D Memory Technologies eBook PDF 23.07.2014 eBooks>Fremdsprachige eBooks>Englische eBooks>Sach- & Fachthemen>Technik, John Wiley & Sons, .201<
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Betty Prince:Vertical 3D Memory Technologies
- new book ISBN: 9781118760451
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and pr… More...
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.Key features:Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.Extensively reviews advanced vertical memory chip technology and developmentExplores technology process routes and 3D chip integration in a single reference; PDF; Scientific, Technical and Medical > Electronics & communications engineering, Wiley<
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He You:Vertical 3D Memory Technologies
- new book ISBN: 9781118760451
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and pr… More...
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later.Key features:Presents a review of the status and trends in 3-dimensional vertical memory chip technologies.Extensively reviews advanced vertical memory chip technology and developmentExplores technology process routes and 3D chip integration in a single reference; PDF; Scientific, Technical and Medical > Electronics & communications engineering, Wiley<
| | hive.co.ukNo. 9781118760451. Shipping costs:Instock, Despatched same working day before 3pm, zzgl. Versandkosten., plus shipping costs Details... |
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
Betty Prince:Vertical 3D Memory Technologies
- First edition 2014, ISBN: 9781118760451
eBooks, eBook Download (PDF), 1. Auflage, [PU: John Wiley & Sons], John Wiley & Sons, 2014
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(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
Betty Prince:Vertical 3D Memory Technologies
- First edition 2014, ISBN: 9781118760451
[ED: 1], Auflage, eBook Download (PDF), eBooks, [PU: Wiley]
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(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
