Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover
1997, ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover
1997, ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover
1997, ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
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1997, ISBN: 0070326193
[EAN: 9780070326194], Neubuch, [PU: McGraw-Hill Professional], Books
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ISBN: 9780070326194
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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover
1997, ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
Harman, George:
Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover1997, ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - hardcover
1997
ISBN: 9780070326194
McGraw-Hill Education, Hardcover, Auflage: 2, 290 Seiten, Publiziert: 1997-09-16T00:00:01Z, Produktgruppe: Book, 0.59 kg, Books Global Store, Special Features, Books, Electronics Engineer… More...
1997, ISBN: 0070326193
[EAN: 9780070326194], Neubuch, [PU: McGraw-Hill Professional], Books
ISBN: 9780070326194
This book is in very good condition and ready for quick shipment, 0
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Details of the book - Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series)
EAN (ISBN-13): 9780070326194
ISBN (ISBN-10): 0070326193
Hardcover
Paperback
Publishing year: 1997
Publisher: McGraw-Hill Education
Book in our database since 2007-04-16T07:19:42-04:00 (New York)
Detail page last modified on 2023-11-07T11:59:20-05:00 (New York)
ISBN/EAN: 9780070326194
ISBN - alternate spelling:
0-07-032619-3, 978-0-07-032619-4
Alternate spelling and related search-keywords:
Book author: harm, george harman
Book title: microelectronic, materials, yield, wire bonding microelectronics
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