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RF and Microwave Microelectronics Packaging - Franklin Kim, Ken Kuang, Sean S. Cahill
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Franklin Kim, Ken Kuang, Sean S. Cahill:
RF and Microwave Microelectronics Packaging - new book

12, ISBN: 9781441909848

ID: 203179781441909848

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packa RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Electronics, Technology, RF and Microwave Microelectronics Packaging~~ Franklin Kim, Ken Kuang, Sean S. Cahill~~Electronics~~Technology~~9781441909848, en, RF and Microwave Microelectronics Packaging, Franklin Kim, Ken Kuang, Sean S. Cahill, 9781441909848, Springer, 12/01/2009, , , , Springer, 12/01/2009

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RF and Microwave Microelectronics Packaging - Sean S. Cahill
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Sean S. Cahill:
RF and Microwave Microelectronics Packaging - new book

ISBN: 9781441909848

ID: 9781441909848

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields., Springer-Verlag Gmbh

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RF and Microwave Microelectronics Packaging - Kuang, Ken; Kim, Franklin; Cahill, Sean S.
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Kuang, Ken; Kim, Franklin; Cahill, Sean S.:
RF and Microwave Microelectronics Packaging - new book

2009, ISBN: 1441909842

ID: 9781441909848

In englischer Sprache. Verlag: Springer US, This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields. PC-PDF, 285 Seiten, XVI Seiten, 285 Seiten, [GR: 9684 - Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik], [SW: - Anlagenbau Elektronik und Nachrichtentechnik (Kommunikationstechnik)], [Ausgabe: 2010][PU:Springer US], [PU: Springer]

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RF and Microwave Microelectronics Packaging als eBook Download von
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RF and Microwave Microelectronics Packaging als eBook Download von - new book

2010, ISBN: 9781441909848

ID: 712708640

RF and Microwave Microelectronics Packaging:2010. Auflage RF and Microwave Microelectronics Packaging:2010. Auflage eBooks > Sachthemen & Ratgeber > Technik, Springer US

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RF and Microwave Microelectronics Packaging - Ken Kuang;  Ken Kuang;  Franklin Kim;  Franklin Kim;  Sean Cahill;  Sean S. Cahill
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Ken Kuang; Ken Kuang; Franklin Kim; Franklin Kim; Sean Cahill; Sean S. Cahill:
RF and Microwave Microelectronics Packaging - First edition

2009, ISBN: 9781441909848

ID: 21777555

[ED: 1], Auflage, eBook Download (PDF), eBooks, [PU: Springer-Verlag]

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Details of the book

Details of the book - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909848
ISBN (ISBN-10): 1441909842
Publishing year: 2009
Publisher: Springer US
285 Pages
Language: eng/Englisch

Book in our database since 22.05.2010 01:59:03
Book found last time on 10.08.2017 16:27:59
ISBN/EAN: 9781441909848

ISBN - alternate spelling:
1-4419-0984-2, 978-1-4419-0984-8


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