2010, ISBN: 1441909613

[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTIO… More...

[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTION HEATING, VENTILATION AIR CONDITIONING; ELECTRONICS CIRCUITS, Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., Books<

2015, ISBN: 9781441909619

[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more funct… More...

[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 241x164x23 mm, 246, [GW: 527g], Banküberweisung, PayPal, Internationaler Versand<

ISBN: 9781441909619

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… More...

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., Springer<

ISBN: 9781441909619

Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld… More...

Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life., 6<

2010, ISBN: 1441909613

[EAN: 9781441909619], New book, [PU: Springer], Books