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1
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - Tadashi Takakura
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Tadashi Takakura:

Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - hardcover

1993, ISBN: 0792321049

[EAN: 9780792321040], Neubuch, [SC: 0.0], [PU: Springer Netherlands], METEOROLOGIE; WITTERUNG; ÖKOLOGIE / GEOGRAFIE, LANDSCHAFT, BODEN; PFLANZE PHYSIOLOGIE; PHYSIOLOGIE (PFLANZE); SYSTEMT… More...

NEW BOOK. Shipping costs:Versandkostenfrei. (EUR 0.00) AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)]
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Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Tadashi Takakura
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Tadashi Takakura:

Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - hardcover

1993, ISBN: 9780792321040

Gebunden, 172 Seiten, 241mm x 160mm x 15mm, Sprache(n): eng From mulching to greenhouses, the air space between the cover and the soil surface is the key to the classification of climates… More...

Shipping costs:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES Buch- und Medienhandel, 14621 Schönwalde-Glien
3
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
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Takakura, Tadashi:
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - hardcover

1993

ISBN: 0792321049

1993 Gebundene Ausgabe Meteorologie, Witterung, Ökologie / Geografie, Landschaft, Boden, Pflanze / Physiologie, Physiologie (Pflanze), Systemtheorie, Pflanzenbiologie, Meteorologie und … More...

Shipping costs:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien
4
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
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Takakura, Tadashi:
Climate Under Cover Digital Dynamic Simulation in Plant Bio-Engineering - hardcover

1993, ISBN: 0792321049

1993 Gebundene Ausgabe Meteorologie, Witterung, Ökologie / Geografie, Landschaft, Boden, Pflanze / Physiologie, Physiologie (Pflanze), Systemtheorie, Pflanzenbiologie, Meteorologie und … More...

Shipping costs:Versandkostenfrei innerhalb der BRD. (EUR 0.00) MARZIES.de Buch- und Medienhandel, 14621 Schönwalde-Glien
5
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - Takakura, Tadashi
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Takakura, Tadashi:
Climate Under Cover : Digital Dynamic Simulation in Plant Bio-Engineering - hardcover

ISBN: 9780792321040

hardback, [PU: Kluwer Academic Publishers]

in stock. Shipping costs:Unknown. (EUR 7.43) Blackwells.co.uk

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Climate under Cover: Digital Dynamic Simulation in Plant Bio-Engineering

From mulching to greenhouses, the air space between the cover and the soil surface is the key to the classification of climates under cover. The same mechanism governs environments produced by the various covers. This book describes and analyses all the different environments from mulching to greenhouses. The relationship between plants and environment is another important topic in the book. Stress is placed on the link between quantitative phenomena and qualitative analyses. Most phenomena involved are nonlinear and non-steady-state. An approach called System Dynamics is used, and simulation models developed in the simulation language CSMP are fully used. The subjects covered are of relevance to graduate students, to scientists and researchers in agriculture and biological sciences and, of course, to agricultural organizations in both the developing and developed countries.

Details of the book - Climate under Cover: Digital Dynamic Simulation in Plant Bio-Engineering


EAN (ISBN-13): 9780792321040
ISBN (ISBN-10): 0792321049
Hardcover
Publishing year: 1993
Publisher: Springer-Verlag GmbH
150 Pages
Weight: 0,426 kg
Language: eng/Englisch

Book in our database since 2007-12-07T13:03:49-05:00 (New York)
Detail page last modified on 2023-12-13T16:48:11-05:00 (New York)
ISBN/EAN: 9780792321040

ISBN - alternate spelling:
0-7923-2104-9, 978-0-7923-2104-0
Alternate spelling and related search-keywords:
Book author: tadashi
Book title: climate under cover, agricultural engineer, bio, plant simulation, digital, climate engineering


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