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ISBN: 9780387979397

ID: 1001004001719913

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to component..., This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Taal: Engels; Afmetingen: 19x234x156 mm; Gewicht: 620,00 gram; Verschijningsdatum: juni 1993; ISBN10: 0387979395; ISBN13: 9780387979397; , Engelstalig | Hardcover | 1993, Techniek & Technologie, Elektrotechniek, Exacte wetenschappen, Techniek & Technologie, Techniek & Mechanica, Techniek & Technologie, Werktuigbouwkunde, Springer-Verlag New York Inc.

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ISBN: 9780387979397

ID: 978038797939

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. Peter A. Engel, Books, Science and Nature, Structural Analysis of Printed Circuit Board Systems: STRUCTURAL ANALYSIS OF PRINTED Books>Science and Nature, Springer New York

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ISBN: 0387979395

ID: 6960573

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. aerospace,electrical and electronics,engineering,mechanical,mechanical engineering,mechanics,physics,science and math,science and math,textbooks Physics, Springer

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ISBN: 9780387979397

[ED: Hardcover], [PU: Springer / Springer New York], Main description: This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. XIX,316 pages - 192 b/w ill. Versandfertig in 3-5 Tagen, [SC: 0.00], Neuware, gewerbliches Angebot

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ISBN: 9780387979397

ID: 1188274

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. Structural Analysis of Printed Circuit Board Systems Engel, Peter A., Springer

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** Details of the book - Structural Analysis of Printed Circuit Board Systems**

EAN (ISBN-13): 9780387979397

ISBN (ISBN-10): 0387979395

Hardcover

Publishing year: 1993

Publisher: Springer-Verlag GmbH

316 Pages

Weight: 0,637 kg

Language: eng/Englisch

Book in our database since 27.01.2007 10:14:37

Book found last time on 24.05.2017 16:26:46

ISBN/EAN: 9780387979397

ISBN - alternate spelling:

0-387-97939-5, 978-0-387-97939-7

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