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Wire Bonding in Microelectronics - George Harman
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George Harman:

Wire Bonding in Microelectronics - new book

ISBN: 9780071642651

ID: 9780071642651

The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today`s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you`ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book`s full-color figures plus animations Wire Bonding in Microelectronics: The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today`s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you`ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book`s full-color figures plus animations, Mcgraw-Hill Education

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WIRE BONDING IN MICROELECTRONICS, 3/E - George Harman
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George Harman:

WIRE BONDING IN MICROELECTRONICS, 3/E - new book

6, ISBN: 9780071642651

ID: 105949780071642651

The Industry Standard Guide to Wire Bonding-Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp o The Industry Standard Guide to Wire Bonding-Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations Electricity, Technology, WIRE BONDING IN MICROELECTRONICS, 3/E~~ George Harman~~Electricity~~Technology~~9780071642651, en, WIRE BONDING IN MICROELECTRONICS, 3/E, George Harman, 9780071642651, McGraw-Hill Education, 06/05/2009, , , , McGraw-Hill Education, 06/05/2009

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Wire Bonding In Microelectronics, 3/E - George Harman
book is out-of-stock
(*)
George Harman:
Wire Bonding In Microelectronics, 3/E - new book

ISBN: 9780071642651

ID: 9780071642651

The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updatedWire bonding is the attachment of fine wires from semiconductor chips to their substratesa connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.Wire Bonding in Microelectronics, Second Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, Wire Bonding In Microelectronics, 3/E: The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updatedWire bonding is the attachment of fine wires from semiconductor chips to their substratesa connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.Wire Bonding in Microelectronics, Second Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, McGraw-Hill

New book Rheinberg-Buch.de
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WIRE BONDING IN MICROELECTRONICS, 3/E - George Harman
book is out-of-stock
(*)
George Harman:
WIRE BONDING IN MICROELECTRONICS, 3/E - new book

ISBN: 9780071642651

The Industry Standard Guide to Wire Bonding—Fully UpdatedThe definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.COVERAGE INCLUDES:Ultrasonic bonding systems and technologies, including high-frequency systemsBonding wire metallurgy and characteristics, including copper wireWire bond testingGold-aluminum intermetallic compounds and other interface reactionsGold and nickel-based bond pad plating materials and problemsCleaning to improve bondability and reliabilityMechanical problems in wire bondingHigh-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bondsCopper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulationCD includes all of the book's full-color figures plus animations. EBooks Books ~~ Technology~~ Electrical WIRE-BONDING-IN-MICROELECTRONICS-3-E~~George-Harman McGraw-Hill Education

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WIRE BONDING IN MICROELECTRONICS, 3/E - George Harman
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George Harman:
WIRE BONDING IN MICROELECTRONICS, 3/E - new book

2010, ISBN: 9780071642651

ID: 26119082

eBook Download (EPUB), eBooks, [PU: McGraw-Hill Professional]

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Details of the book
WIRE BONDING IN MICROELECTRONICS, 3 E
Author:

Harman, George

Title:

WIRE BONDING IN MICROELECTRONICS, 3 E

ISBN:

9780071642651

Details of the book - WIRE BONDING IN MICROELECTRONICS, 3 E


EAN (ISBN-13): 9780071642651
Publishing year: 2010
Publisher: McGraw-Hill Education

Book in our database since 20.12.2008 12:22:39
Book found last time on 04.02.2017 12:07:04
ISBN/EAN: 9780071642651

ISBN - alternate spelling:
978-0-07-164265-1

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