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Wire Bonding in Microelectronics - Harman, George
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Harman, George:

Wire Bonding in Microelectronics

EAN: 9780071476232

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Wire Bonding in Microelectronics (English Edition) - Harman, George
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Harman, George:

Wire Bonding in Microelectronics (English Edition) - new book

2009, ISBN: 9780071476232

McGraw Hill, Kindle Ausgabe, Auflage: 3, 724 Seiten, Publiziert: 2009-06-05T00:00:00.000Z, Produktgruppe: Digital Ebook Purchas, Elektrotechnik, Ingenieurwissenschaft & Technik, Naturwiss… More...

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WIRE BONDING IN MICROELECTRONICS, 3/E: Materials, Processes, Reliability, and Yield - George Harman
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George Harman:
WIRE BONDING IN MICROELECTRONICS, 3/E: Materials, Processes, Reliability, and Yield - new book

ISBN: 9780071476232

The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies--completely updated.; Science & Nature, McGraw-Hill Professional

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Harman, George:
WIRE BONDING IN MICROELECTRONICS, 3/E - hardcover

2010, ISBN: 9780071476232

McGraw-Hill Professional, 2010-01-20. Hardcover. Good. 6x1x9., McGraw-Hill Professional, 2010-01-20, 2.5

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Harman, George:
WIRE BONDING IN MICROELECTRONICS, 3/E - hardcover

2010, ISBN: 0071476237

[EAN: 9780071476232], [SC: 21.39], [PU: McGraw Hill], Books

Shipping costs: EUR 21.39 Blue Rock Books, Marbella, MA, Spain [73036531] [Rating: 5 (of 5)]
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Wire Bonding in Microelectronics (English Edition)
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ISBN:

9780071476232


The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updated Wire bonding is the attachment of fine wires from semiconductor chips to their substrates--a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. "Wire Bonding in Microelectronics, Third Edition, " equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping, and more.

Details of the book - Wire Bonding in Microelectronics (English Edition)


EAN (ISBN-13): 9780071476232
ISBN (ISBN-10): 0071476237
Hardcover
Publishing year: 2010
Publisher: McGraw Hill
426 Pages
Weight: 0,784 kg
Language: eng/Englisch

Book in our database since 2007-07-16T08:27:15-04:00 (New York)
Detail page last modified on 2023-07-06T03:15:50-04:00 (New York)
ISBN/EAN: 9780071476232

ISBN - alternate spelling:
0-07-147623-7, 978-0-07-147623-2
Alternate spelling and related search-keywords:
Book author: george harman, mcgraw hill
Book title: bondi, wire bonding microelectronics, wir, bond, the wire

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