ISBN: 0071363270

[SR: 582931], Gebundene Ausgabe, [EAN: 9780071363273], Mcgraw Hill Book Co, Mcgraw Hill Book Co, Book, [PU: Mcgraw Hill Book Co], Mcgraw Hill Book Co, 60522011, Kreisläufe, 60516011, Elek… More...

[SR: 582931], Gebundene Ausgabe, [EAN: 9780071363273], Mcgraw Hill Book Co, Mcgraw Hill Book Co, Book, [PU: Mcgraw Hill Book Co], Mcgraw Hill Book Co, 60522011, Kreisläufe, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60518011, Prinzip der Elektrizität, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 60525011, Elektronik, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 56441011, Technologie, 56447011, Erneuerbare Energien, 56448011, Innovationen, 1320311031, Nachschlagewerke, 56444011, Nanotechnologie, 56449011, Philosophie der Technologie, 56445011, Risiken, 56446011, Sicherheit & Gesundheit, 273011011, Soziale Aspekte, 54518011, Technisches Denken & Schreiben, 56451011, Technologie & Gesellschaft, 56211011, Technologiegeschichte, 56442011, Zukunftsforschung, 56047011, Wissenschaft, 54071011, Genres, 52044011, Fremdsprachige Bücher<

ISBN: 9780071363273

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at… More...

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that's changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee's intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba. Technology Technology eBook, McGraw-Hill Education<

ISBN: 9780071363273

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look … More...

State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that's changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee's intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba. Technology Technology eBook, McGraw-Hill Education<

ISBN: 9780071363273

Microvias For low cost high Density Interconnects 1st International Edition Author :John H. Lau 9780071363273 0071363270, [PU: McGraw Hill]

ISBN: 0071363270

Fnac.com : Livraison gratuite et - 5% sur tous les livres. Microvias - Livre. Découvrez des nouveautés, des coups de cœur, des avis d'internautes, … Livre - Livre, McGraw-Hill