English
United States
Sign in
Tip from find-more-books.com
Similar books
More/other books that might be very similar to this book
Search tools
Book recommendations
Latest news
Advertising
FILTER
- 0 Results
Lowest price: 118.98 €, highest price: 168.34 €, average price: 153.46 €
RF and Microwave Microelectronics Packaging - Ken Kuang
book is out-of-stock
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - new book

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. -, DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung, Internationaler Versand

New book Booklooker.de
Rhein-Team Lörrach
Shipping costs:Versandkostenfrei. (EUR 0.00)
Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
RF and Microwave Microelectronics Packaging - Ken Kuang
book is out-of-stock
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - new book

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], PayPal, Banküberweisung, Internationaler Versand

New book Booklooker.de
Sellonnet GmbH
Shipping costs:Versandkostenfrei. (EUR 0.00)
Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
RF and Microwave Microelectronics Packaging - Ken Kuang
book is out-of-stock
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - new book

2009, ISBN: 1441909834

ID: 9730369344

[EAN: 9781441909831], Neubuch, [SC: 0.0], [PU: Springer-Verlag Gmbh Nov 2009], ELEKTRONIK / MIKROELEKTRONIK; MIKROELEKTRONIK, Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. 285 pp. Englisch

New book ZVAB.com
AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)]
NEW BOOK. Shipping costs:Versandkostenfrei. (EUR 0.00)
Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
RF and Microwave Microelectronics Packaging - Ken Kuang
book is out-of-stock
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - new book

1, ISBN: 9781441909831

[ED: Buch], [PU: Springer-Verlag GmbH], Neuware - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields., DE, [SC: 0.00], Neuware, gewerbliches Angebot, 243x164x34 mm, 285, [GW: 635g], offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung

New book Booklooker.de
buchZ AG
Shipping costs:Versandkostenfrei. (EUR 0.00)
Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.
RF and Microwave Microelectronics Packaging - Ken Kuang
book is out-of-stock
(*)
Ken Kuang:
RF and Microwave Microelectronics Packaging - hardcover

ISBN: 9781441909831

Hardback, [PU: Springer-Verlag New York Inc.], This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields., Microwave Technology

New book Bookdepository.com
Shipping costs:Versandkostenfrei. (EUR 0.00)
Details...
(*) Book out-of-stock means that the book is currently not available at any of the associated platforms we search.

Details of the book
RF and Microwave Microelectronics Packaging

New, ship fast, delivered in 5 days in Germany No PO Box.

Details of the book - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Hardcover
Publishing year: 2009
Publisher: Springer-Verlag GmbH
285 Pages
Weight: 0,635 kg
Language: eng/Englisch

Book in our database since 09.08.2007 02:08:01
Book found last time on 02.01.2018 07:58:05
ISBN/EAN: 1441909834

ISBN - alternate spelling:
1-4419-0983-4, 978-1-4419-0983-1


< to archive...
Related books