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Three Dimensional System Integration - Antonis Papanikolaou
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Antonis Papanikolaou:

Three Dimensional System Integration - new book

ISBN: 9781441909626

ID: 9781441909626

IC Stacking Process and Design Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three Dimensional System Integration: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. CAD - Computer Aided Design Computer Aided Design ( CAD ) ARCHITECTURE / Methods & Materials, Springer-Verlag Gmbh

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Three Dimensional System Integration - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
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Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic:

Three Dimensional System Integration - new book

12, ISBN: 9781441909626

ID: 203179781441909626

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g, mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g, mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Methods & Materials, Architecture, Three Dimensional System Integration~~ Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic~~Methods & Materials~~Architecture~~9781441909626, en, Three Dimensional System Integration, Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic, 9781441909626, Springer, 12/07/2010, , , , Springer, 12/07/2010

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Three Dimensional System Integration - IC Stacking Process and Design - Papanikolaou, Antonis; Soudris, Dimitrios; Radojcic, Riko
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Papanikolaou, Antonis; Soudris, Dimitrios; Radojcic, Riko:
Three Dimensional System Integration - IC Stacking Process and Design - new book

2010

ISBN: 1441909621

ID: 9781441909626

In englischer Sprache. Verlag: Springer US, The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach. PC-PDF, 246 Seiten, VIII Seiten, 246 Seiten, [GR: 9685 - Nonbooks, PBS / Technik/Bautechnik, Umwelttechnik], [SW: - Technologie, Ingenieurswissenschaft, Landwirtschaft ], [Ausgabe: 2011][PU:Springer US], [PU: Springer]

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Three Dimensional System Integration - Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
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Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic:
Three Dimensional System Integration - new book

ISBN: 9781441909626

ID: 9781441909626

Architecture / Design; Basics of Construction; Circuits and Systems 3D Chip Stacking, 3D Integrated Circuit Design and Manufacturing, 3D Integrated Circuits, 3D Stacked Integrated Circuits, 3D System Integration, Contactless 3D Coupling, DRAM Stacking, Logic Stacking, TSV, Through-Silicon Vias Books eBook, Springer Science+Business Media

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Three Dimensional System Integration - Antonis Papanikolaou;  Antonis Papanikolaou;  Dimitrios Soudris;  Dimitrios Soudris;  Riko Radojcic;  Riko Radojcic
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Antonis Papanikolaou; Antonis Papanikolaou; Dimitrios Soudris; Dimitrios Soudris; Riko Radojcic; Riko Radojcic:
Three Dimensional System Integration - First edition

2010, ISBN: 9781441909626

ID: 21778702

IC Stacking Process and Design, [ED: 1], Auflage, eBook Download (PDF), eBooks, [PU: Springer-Verlag]

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Details of the book
Three Dimensional System Integration: IC Stacking Process and Design
Author:

Antonis Papanikolaou;Dimitrios Soudris;Riko Radojcic

Title:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN:

1441909621

Details of the book - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909626
ISBN (ISBN-10): 1441909621
Publishing year: 2010
Publisher: Springer US
246 Pages
Language: eng/Englisch

Book in our database since 23.06.2012 02:28:56
Book found last time on 22.03.2017 19:57:41
ISBN/EAN: 1441909621

ISBN - alternate spelling:
1-4419-0962-1, 978-1-4419-0962-6

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