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Nanoparticle Engineering for Chemical-mechanical Planarization - Ungyu Paik, Jea-Gun Park
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Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization - hardcover

ISBN: 1420059114

ID: 1289756068

[EAN: 9781420059113], Neubuch, [PU: Taylor & Francis Inc], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, BRAND NEW, Nanoparticle Engineering for Chemical-mechanical Planarization, Ungyu Paik, Jea-Gun Park, In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - Ungyu Paik, Jea-Gun Park
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Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - hardcover

2009, ISBN: 1420059114

ID: 2685273959

[EAN: 9781420059113], Neubuch, [PU: Taylor Francis Inc, United States], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, Language: English . Brand New Book. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - Ungyu Paik, Jea-Gun Park
book is out-of-stock
(*)
Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - hardcover

2009, ISBN: 1420059114

ID: 11228663021

[EAN: 9781420059113], Neubuch, [PU: Taylor Francis Inc, United States], Science|Chemistry|Industrial & Technical, Technology|Electronics|Microelectronics, Technology|Material Science, Technology|Nanotechnology, Language: English . Brand New Book. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - Ungyu Paik, Jea-Gun Park
book is out-of-stock
(*)
Ungyu Paik, Jea-Gun Park:
Nanoparticle Engineering for Chemical-mechanical Planarization (Hardback) - hardcover

2009, ISBN: 1420059114

ID: 11228663021

[EAN: 9781420059113], Neubuch, [PU: Taylor Francis Inc, United States], Language: English Brand New Book. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

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Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices 1st Edition - Jea-Gun Park Ungyu Paik
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Jea-Gun Park Ungyu Paik:
Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices 1st Edition - new book

ISBN: 9781420059113

ID: 9781420059113

Nanoparticle Engineering for Chemical-Mechanical Planarization Fabrication of Next-Generation Nanodevices 1st Edition Author :Jea-Gun Park Ungyu Paik 9781420059113 1420059114, [PU: CRC Press]

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Details of the book
Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices
Author:

Paik, Ungyu; Park, Jea-Gun

Title:

Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices

ISBN:

Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.

Details of the book - Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices


EAN (ISBN-13): 9781420059113
ISBN (ISBN-10): 1420059114
Hardcover
Publishing year: 2009
Publisher: CRC PR INC
191 Pages
Weight: 0,499 kg
Language: eng/Englisch

Book in our database since 11.06.2008 00:04:11
Book found last time on 11.08.2016 16:39:34
ISBN/EAN: 1420059114

ISBN - alternate spelling:
1-4200-5911-4, 978-1-4200-5911-3


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