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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov
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Mikhail Baklanov:

Dielectric Films for Advanced Microelectronics - new book

ISBN: 9780470065419

ID: 9780470065419

InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov& #160 Roizin& #160 and Vladimir& #160 Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical& #160 Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielectric Films for Advanced Microelectronics: InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov& #160 Roizin& #160 and Vladimir& #160 Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical& #160 Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielektrizität Dielectrics & Electric Insulators Materialwissenschaften Mikroelektronik Dünne Schichten, Oberflächen u. Grenzflächen Elektrotechnik u. Elektronik Dielektrika u. Isolatoren Electrical & Electronics Engineering Materials Science Thi, John Wiley & Sons

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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov
book is out-of-stock
(*)

Mikhail Baklanov:

Dielectric Films for Advanced Microelectronics - new book

ISBN: 9780470065419

ID: 9780470065419

InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov  Roizin  and Vladimir  Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical  Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielectric Films for Advanced Microelectronics: InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov  Roizin  and Vladimir  Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical  Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielektrizität Dielectrics & Electric Insulators Materialwissenschaften Mikroelektronik Dünne Schichten, Oberflächen u. Grenzflächen Elektrotechnik u. Elektronik Dielektrika u. Isolatoren Electrical & Electronics Engineering Materials Science Thi, John Wiley & Sons

New book Rheinberg-Buch.de
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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov
book is out-of-stock
(*)
Mikhail Baklanov:
Dielectric Films for Advanced Microelectronics - new book

ISBN: 9780470065419

ID: 9780470065419

InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov  Roizin  and Vladimir  Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical  Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielectric Films for Advanced Microelectronics: InhaltsangabeSeries Preface.Preface. (Mikhail Baklanov, Martin Green and Karen Maex).1. Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition. (A. Grill).2. Spin-On Dielectric Materials. (Geraud Dubois, Willi Volksen and Robert D. Miller).3.Porosity of Low Dielectric Constant Materials.3.1 Positron Annihilation Spectroscopy. (David W. Gidley, Hua-Gen Peng, and Richard Vallery).3.2Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation. (Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K. Lin, Wen-li Wu).3.3 Ellipsometric Porosimetry. (M. R. Baklanov).4.Mechanical and Transport Properties of Low-k Dielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O. Rodriguez, R. Saxena, and W.N. Gill).5. Integration of low-k dielectric films in damascene processes. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M. Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F. Iacopi).6. ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application. (Yakov  Roizin  and Vladimir  Gritsenko).High Dielectric constant Materials.7. Material Engineering of High-k Gate Dielectrics. (Akira Toriumi and Koji Kita).8. Physical Characterisation of ultra-thin high-k dielectric. (T. Conard, H. Bender and W. Vandervorst).9. Electrical  Characterization of Advanced Gate Dielectrics. (Robin Degraeve, Jurriaan Schmitz, Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, and Guido Groeseneken).Medium dielectric constant materials.10. Integration Issues of High-k Gate Dielectrics. (Yasuo Nara).Dielectric films for interconnects (packaging).11. Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects. (Yi Li, C. P. Wong).Index. Dielectrics & Electric Insulators Dielektrika u. Isolatoren Dielektrizität Dünne Schichten, Oberflächen u. Grenzflächen Electrical & Electronics Engineering Elektrotechnik u. Elektronik Materials Science Materialwissenschaften Mikroelektronik Thi, John Wiley & Sons

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Dielectric Films for Advanced Microelectronics - Baklanov, Mikhail; Maex, Karen; Green, Martin
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Baklanov, Mikhail; Maex, Karen; Green, Martin:
Dielectric Films for Advanced Microelectronics - new book

2007, ISBN: 0470065419

ID: 9780470065419

In englischer Sprache. Verlag: John Wiley & Sons, Series Preface. Preface. (Mikhail Baklanov, Martin Green and KarenMaex). 1. Low and Ultralow Dielectric Constant Films Preparedby Plasma-Enhanced Chemical Vapor Deposition. (A.Grill). 2. Spin-On Dielectric Materials. (GeraudDubois, Willi Volksen and Robert D. Miller). 3.Porosity of Low Dielectric Constant Materials. 3.1 Positron Annihilation Spectroscopy. (David W.Gidley, Hua-Gen Peng, and Richard Vallery). 3.2Structure Characterization of Nanoporous InterlevelDielectric Thin Films with X-ray and Neutron Radiation.(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K.Lin, Wen-li Wu). 3.3 Ellipsometric Porosimetry. (M. R.Baklanov). 4.Mechanical and Transport Properties of Low-kDielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O.Rodriguez, R. Saxena, and W.N. Gill). 5. Integration of low-k dielectric films in damasceneprocesses. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M.Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F.Iacopi). 6. ONO structures and oxynitrides in modern microelectronics.Material science, characterization and application.(Yakov Roizin and Vladimir Gritsenko). High Dielectric constant Materials. 7. Material Engineering of High-k GateDielectrics. (Akira Toriumi and Koji Kita). 8. PhysicalCharacterisation of ultra-thin high-k dielectric. (T.Conard, H. Bender and W. Vandervorst). 9. Electrical Characterization of Advanced GateDielectrics. (Robin Degraeve, Jurriaan Schmitz,Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, andGuido Groeseneken). Medium dielectric constant materials. 10. Integration Issues of High-k Gate Dielectrics.(Yasuo Nara). Dielectric films for interconnects (packaging). 11. Anisotropic Conductive Film (ACF) for AdvancedMicroelectronic Interconnects. (Yi Li, C. P.Wong). Index. PC-PDF, 508 Seiten, 508 Seiten, 1., Auflage, [GR: 9650 - Nonbooks, PBS / Chemie], [SW: - Chemie ], [Ausgabe: 1][PU:John Wiley & Sons], [PU: Wiley]

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Dielectric Films For Advanced Microelectronics - Wiley
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Wiley:
Dielectric Films For Advanced Microelectronics - new book

2007, ISBN: 9780470065419

ID: 5575486

The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical. The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films. eBooks, , Dielectric Films For Advanced Microelectronics~~EBook~~9780470065419~~Mikhail Baklanov, Karen Maex, Martin Green, , Dielectric Films For Advanced Microelectronics, , 9780470065419, Wiley, 04/04/2007, , , , Wiley

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Details of the book
Dielectric Films for Advanced Microelectronics
Author:

Baklanov, Mikhail; Maex, Karen; Green, Martin

Title:

Dielectric Films for Advanced Microelectronics

ISBN:

0470065419

Details of the book - Dielectric Films for Advanced Microelectronics


EAN (ISBN-13): 9780470065419
ISBN (ISBN-10): 0470065419
Publishing year: 2007
Publisher: Wiley, J
508 Pages
Language: eng/Englisch

Book in our database since 27.11.2009 12:40:01
Book found last time on 11.08.2016 08:19:33
ISBN/EAN: 0470065419

ISBN - alternate spelling:
0-470-06541-9, 978-0-470-06541-9

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