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RF and Microwave Microelectronics Packaging by Ken Kuang Hardcover | Indigo Chapters
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RF and Microwave Microelectronics Packaging by Ken Kuang Hardcover | Indigo Chapters - new book

ISBN: 9781441909831

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… More...

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RF and Microwave Microelectronics Packaging - hardcover

2009, ISBN: 9781441909831

Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… More...

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RF and Microwave Microelectronics Packaging - Ken Kuang
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Ken Kuang:
RF and Microwave Microelectronics Packaging - hardcover

ISBN: 9781441909831

Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … More...

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Kuang, Ken [Editor]; Kim, Franklin [Editor]; Cahill, Sean S. [Editor];:
RF and Microwave Microelectronics Packaging - hardcover

ISBN: 9781441909831

Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6

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RF and Microwave Microelectronics Packaging - Kuang, Ken
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Kuang, Ken:
RF and Microwave Microelectronics Packaging - hardcover

2009, ISBN: 1441909834

[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books

NEW BOOK. Shipping costs:Free shipping. (EUR 0.00) Welcome Back Books, Toledo, OH, U.S.A. [64434632] [Rating: 5 (of 5)]
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RF and Microwave Microelectronics Packaging
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1441909834


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Details of the book - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Hardcover
Publishing year: 2009
Publisher: Springer
285 Pages
Weight: 0,635 kg
Language: eng/Englisch

Book in our database since 2007-08-08T20:08:01-04:00 (New York)
Detail page last modified on 2023-07-29T09:36:34-04:00 (New York)
ISBN/EAN: 1441909834

ISBN - alternate spelling:
1-4419-0983-4, 978-1-4419-0983-1
Alternate spelling and related search-keywords:
Book author: cahill, franklin, kim, kuang
Book title: self packaging, microwave for one, microelectronics

Information from Publisher

Author: Ken Kuang; Franklin Kim; Sean S. Cahill
Title: RF and Microwave Microelectronics Packaging
Publisher: Springer; Springer US
285 Pages
Publishing year: 2009-11-17
New York; NY; US
Printed / Made in
Language: English
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XVI, 285 p.

BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); EA; BC

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.
Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras

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