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Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
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Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic:

Three Dimensional System Integration: IC Stacking Process and Design - hardcover

ISBN: 1441909613

[SR: 5477602], Hardcover, [EAN: 9781441909619], Springer, Springer, Book, [PU: Springer], Springer, Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain., 266160, Drafting & Presentation, 173508, Architecture, 1, Arts & Photography, 1000, Subjects, 283155, Books, 3508, Computer Science, 3887, AI & Machine Learning, 760204, Bioinformatics, 132559011, Computer Simulation, 107196011, Cybernetics, 132574011, Human-Computer Interaction, 107197011, Information Theory, 3897, Robotics, 602672, Systems Analysis & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 4075, CAD, 3939, Solidworks, 4134, Graphics & Design, 5, Computers & Technology, 1000, Subjects, 283155, Books, 107178011, Design, 13698, Circuits, 227544, Electrical & Electronics, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 1058, Methods & Materials, 1061, Architecture, 13803, Reference, 173515, Engineering, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 468204, Computer Science, 491298, Algorithms, 491300, Artificial Intelligence, 491306, Database Storage & Design, 491308, Graphics & Visualization, 491302, Networking, 491310, Object-Oriented Software Design, 491312, Operating Systems, 491314, Programming Languages, 491316, Software Design & Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books, 468210, Architecture, 468206, Humanities, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Three Dimensional System Integration: IC Stacking Process and Design - Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko
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Three Dimensional System Integration: IC Stacking Process and Design - used book

ISBN: 9781441909619

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three Dimensional System Integration: IC Stacking Process and Design Papanikolaou, Antonis / Soudris, Dimitrios / Radojcic, Riko, Springer

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Antonis Papanikolaou (Editor), Dimitrios Soudris (Editor), Riko Radojcic (Editor):
Three Dimensional System Integration: IC Stacking Process and Design - hardcover

2011

ISBN: 9781441909619

ID: 550577766

Springer, 2010-12-15. 2011. Hardcover. Used:Good. Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service., Springer, 2010-12-15

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Three Dimensional System Integration - hardcover

2010, ISBN: 9781441909619

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Springer Verlag, 2010. Hardcover. New. SKU: MM-20381725; EAN: 9781441909619, Springer Verlag, 2010

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Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic:
Three Dimensional System Integration - hardcover

2010, ISBN: 9781441909619

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Details of the book
Three Dimensional System Integration: IC Stacking Process and Design
Author:

Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic

Title:

Three Dimensional System Integration: IC Stacking Process and Design

ISBN:

9781441909619

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Details of the book - Three Dimensional System Integration: IC Stacking Process and Design


EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Hardcover
Paperback
Publishing year: 2010
Publisher: Springer-Verlag GmbH
246 Pages
Weight: 0,527 kg
Language: eng/Englisch

Book in our database since 22.04.2008 15:15:08
Book found last time on 23.11.2016 20:52:42
ISBN/EAN: 9781441909619

ISBN - alternate spelling:
1-4419-0961-3, 978-1-4419-0961-9

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