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Dielectric Films for Advanced Microelectronics - John Paul Mueller
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Dielectric Films for Advanced Microelectronics - new book

ISBN: 9780470065419

The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in… More...

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Dielectric Films for Advanced Microelectronics - John Wiley & Sons Inc
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Dielectric Films for Advanced Microelectronics - new book

2007, ISBN: 9780470065419

The topic of thin films is an area of increasing importance inmaterials science, electrical engineering and applied solid statephysics; with both research and industrial applications inmi… More...

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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov; Karen Maex; Martin Green
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Mikhail Baklanov; Karen Maex; Martin Green:
Dielectric Films for Advanced Microelectronics - First edition

2007

ISBN: 9780470065419

eBooks, eBook Download (PDF), 1. Auflage, [PU: John Wiley & Sons], John Wiley & Sons, 2007

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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov; Karen Maex; Martin Green
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Mikhail Baklanov; Karen Maex; Martin Green:
Dielectric Films for Advanced Microelectronics - First edition

2007, ISBN: 9780470065419

eBooks, eBook Download (PDF), Auflage, [PU: Wiley], [ED: 1], Wiley, 2007

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Dielectric Films for Advanced Microelectronics - Mikhail Baklanov; Martin Green; Karen Maex
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Mikhail Baklanov; Martin Green; Karen Maex:
Dielectric Films for Advanced Microelectronics - First edition

2007, ISBN: 9780470065419

eBooks, eBook Download (PDF), 1. Auflage, [PU: Wiley], Wiley, 2007

Shipping costs:Download sofort lieferbar. (EUR 0.00)

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Details of the book - Dielectric Films for Advanced Microelectronics


EAN (ISBN-13): 9780470065419
ISBN (ISBN-10): 0470065419
Publishing year: 2007
Publisher: Wiley
508 Pages
Language: eng/Englisch

Book in our database since 2009-11-27T06:40:01-05:00 (New York)
Detail page last modified on 2023-11-06T12:24:21-05:00 (New York)
ISBN/EAN: 9780470065419

ISBN - alternate spelling:
0-470-06541-9, 978-0-470-06541-9
Alternate spelling and related search-keywords:
Book author: martin green, marti green, green karen, john paul, martin mae, baklanov
Book title: microelectronics


Information from Publisher

Author: Mikhail Baklanov
Title: Wiley Series in Materials for Electronic & Optoelectronic Applications; Dielectric Films for Advanced Microelectronics
Publisher: Wiley; John Wiley & Sons
508 Pages
Publishing year: 2007-04-04
Language: English
208,99 € (DE)

EA; E107; E-Book; Nonbooks, PBS / Chemie; Technische Anwendung von Oberflächenbeschichtungen und -filmen; Dielectrics & Electric Insulators; Dielektrika u. Isolatoren; Dielektrizität; Dünne Schichten, Oberflächen u. Grenzflächen; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Materials Science; Materialwissenschaften; Mikroelektronik; Thin Films, Surfaces & Interfaces; Dielektrika u. Isolatoren; Dünne Schichten, Oberflächen u. Grenzflächen; BB

Series Preface. Preface. (Mikhail Baklanov, Martin Green and KarenMaex). 1. Low and Ultralow Dielectric Constant Films Preparedby Plasma-Enhanced Chemical Vapor Deposition. (A.Grill). 2. Spin-On Dielectric Materials. (GeraudDubois, Willi Volksen and Robert D. Miller). 3.Porosity of Low Dielectric Constant Materials. 3.1 Positron Annihilation Spectroscopy. (David W.Gidley, Hua-Gen Peng, and Richard Vallery). 3.2Structure Characterization of Nanoporous InterlevelDielectric Thin Films with X-ray and Neutron Radiation.(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K.Lin, Wen-li Wu). 3.3 Ellipsometric Porosimetry. (M. R.Baklanov). 4.Mechanical and Transport Properties of Low-kDielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O.Rodriguez, R. Saxena, and W.N. Gill). 5. Integration of low-k dielectric films in damasceneprocesses. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M.Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F.Iacopi). 6. ONO structures and oxynitrides in modern microelectronics.Material science, characterization and application.(Yakov Roizin and Vladimir Gritsenko). High Dielectric constant Materials. 7. Material Engineering of High-k GateDielectrics. (Akira Toriumi and Koji Kita). 8. PhysicalCharacterisation of ultra-thin high-k dielectric. (T.Conard, H. Bender and W. Vandervorst). 9. Electrical Characterization of Advanced GateDielectrics. (Robin Degraeve, Jurriaan Schmitz,Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, andGuido Groeseneken). Medium dielectric constant materials. 10. Integration Issues of High-k Gate Dielectrics.(Yasuo Nara). Dielectric films for interconnects (packaging). 11. Anisotropic Conductive Film (ACF) for AdvancedMicroelectronic Interconnects. (Yi Li, C. P.Wong). Index.

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