2010, ISBN: 1849965773
[EAN: 9781849965774], Neubuch, [SC: 0.0], [PU: Springer London], LEADSUBSTITUTES; METALL; SOLDERALLOYS; STANDARD; ARCHITECTURE; DESIGN; ELECTRONICS; MANUFACTURING; METAL; MICROSTRUCTURE; … More...
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Shipping costs:Versandkostenfrei. (EUR 0.00) Details... |
2010, ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed s… More...
booklooker.de buecher.de GmbH & Co. KG Shipping costs:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Details... |
2002, ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… More...
Springer.com Nr. 978-1-84996-577-4. Shipping costs:Worldwide free shipping, , plus shipping costs. (EUR 0.00) Details... |
2010, ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… More...
booklooker.de buecher.de GmbH & Co. KG Shipping costs:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Details... |
2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… More...
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2010, ISBN: 1849965773
[EAN: 9781849965774], Neubuch, [SC: 0.0], [PU: Springer London], LEADSUBSTITUTES; METALL; SOLDERALLOYS; STANDARD; ARCHITECTURE; DESIGN; ELECTRONICS; MANUFACTURING; METAL; MICROSTRUCTURE; … More...
2010, ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed s… More...
2002
ISBN: 9781849965774
The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… More...
2010, ISBN: 9781849965774
[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… More...
2007, ISBN: 9781849965774
*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… More...
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Details of the CD - A Guide to Lead-free Solders
EAN (ISBN-13): 9781849965774
ISBN (ISBN-10): 1849965773
Hardcover
Paperback
Publishing year: 2010
Publisher: Springer London
220 Pages
Weight: 0,339 kg
Language: eng/Englisch
CD in our database since 2011-05-18T05:37:04-04:00 (New York)
Detail page last modified on 2024-04-15T15:10:38-04:00 (New York)
EAN: 1849965773
EAN - alternate spelling:
1-84996-577-3, 978-1-84996-577-4
Alternate spelling and related search-keywords:
CD artist: john evans, eva engel, werner eva
CD title: physical metallurgy, lead
Information from Publisher
Author: John W. Evans
Title: A Guide to Lead-free Solders - Physical Metallurgy and Reliability
Publisher: Springer; Springer London
206 Pages
Publishing year: 2010-10-13
London; GB
Printed / Made in
Language: English
133,70 € (DE)
137,45 € (AT)
179,85 CHF (CH)
POD
XIV, 206 p. 114 illus.
BC; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; Lead Substitutes; Metall; Solder Alloys; Standard; architecture; cutting; design; electronics; manufacturing; materials; metal; metallurgy; microstructure; production; reliability; quality control, reliability, safety and risk; Electronics and Microelectronics, Instrumentation; Metals and Alloys; Optical Materials; Security Science and Technology; Mechanical Engineering; Machines, Tools, Processes; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Sicherheitssysteme und Brandmeldeanlagen; Maschinenbau; Fertigungstechnik und Ingenieurwesen; BB
to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.Covers all aspects of lead-free solders from physical properties to product assurance The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weaknesses and with the properties of the lead-based solders currently in use The theoretical basis of the book will allow solder producers to make solders with more desirable properties in the future Includes supplementary material: sn.pub/extras
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