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RF and Microwave Microelectronics Packaging - Serguei Cheloukhine
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RF and Microwave Microelectronics Packaging - new book

ISBN: 9781441909848

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… More...

No. 9781441909848. Shipping costs:Instock, Despatched same working day before 3pm, plus shipping costs.
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RF and Microwave Microelectronics Packaging
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RF and Microwave Microelectronics Packaging - new book

ISBN: 9781441909848

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… More...

Nr. A1031451882. Shipping costs:Lieferzeiten außerhalb der Schweiz 3 bis 21 Werktage, , Sofort per Download lieferbar, zzgl. Versandkosten. (EUR 17.48)
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RF and Microwave Microelectronics Packaging - Sean S. Cahill; Franklin Kim; Ken Kuang
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Sean S. Cahill; Franklin Kim; Ken Kuang:
RF and Microwave Microelectronics Packaging - new book

2009

ISBN: 9781441909848

eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … More...

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RF and Microwave Microelectronics Packaging
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RF and Microwave Microelectronics Packaging - new book

2009, ISBN: 9781441909848

Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … More...

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RF and Microwave Microelectronics Packaging - Ken Kuang; Franklin Kim; Sean S. Cahill
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Ken Kuang; Franklin Kim; Sean S. Cahill:
RF and Microwave Microelectronics Packaging - new book

2009, ISBN: 9781441909848

eBooks, eBook Download (PDF), 2010, [PU: Springer US], Springer US, 2009

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RF and Microwave Microelectronics Packaging
Author:
Title:
ISBN:

1441909842

Details of the book - RF and Microwave Microelectronics Packaging


EAN (ISBN-13): 9781441909848
ISBN (ISBN-10): 1441909842
Publishing year: 2009
Publisher: Springer
285 Pages
Language: eng/Englisch

Book in our database since 2010-05-21T19:59:03-04:00 (New York)
Detail page last modified on 2023-06-25T08:40:54-04:00 (New York)
ISBN/EAN: 1441909842

ISBN - alternate spelling:
1-4419-0984-2, 978-1-4419-0984-8
Alternate spelling and related search-keywords:
Book author: cahill, kuang
Book title: self packaging, microwave for one, microelectronics

Information from Publisher

Author: Ken Kuang; Franklin Kim; Sean S. Cahill
Title: RF and Microwave Microelectronics Packaging
Publisher: Springer; Springer US
285 Pages
Publishing year: 2009-12-01
New York; NY; US
Language: English
149,79 € (DE)
154,00 € (AT)
177,00 CHF (CH)
Available
XVI, 285 p.

EA; E107; eBook; Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; C; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Engineering; Schaltkreise und Komponenten (Bauteile); BB

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.
Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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