2010, ISBN: 1441909613
[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTIO… More...
ZVAB.com AHA-BUCH GmbH, Einbeck, Germany [51283250] [Rating: 5 (von 5)] NEW BOOK. Shipping costs:Versandkostenfrei. (EUR 0.00) Details... |
2015, ISBN: 9781441909619
[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more funct… More...
booklooker.de BuchWeltWeit Inh. Ludwig Meier e.K. Shipping costs:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Details... |
ISBN: 9781441909619
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… More...
Springer.com Nr. 978-1-4419-0961-9. Shipping costs:Worldwide free shipping, , DE. (EUR 0.00) Details... |
ISBN: 9781441909619
Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld… More...
Biblio.co.uk |
2010, ISBN: 1441909613
[EAN: 9781441909619], New book, [PU: Springer], Books
AbeBooks.com Lucky's Textbooks, Dallas, TX, U.S.A. [60577173] [Rating: 5 (of 5)] NEW BOOK. Shipping costs: EUR 3.99 Details... |
2010, ISBN: 1441909613
[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTIO… More...
2015, ISBN: 9781441909619
[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more funct… More...
ISBN: 9781441909619
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… More...
ISBN: 9781441909619
Hardback. New. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld… More...
2010, ISBN: 1441909613
[EAN: 9781441909619], New book, [PU: Springer], Books
Bibliographic data of the best matching book
Details of the book - Three Dimensional System Integration: IC Stacking Process and Design
EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Hardcover
Paperback
Publishing year: 2010
Publisher: Springer
246 Pages
Weight: 0,527 kg
Language: eng/Englisch
Book in our database since 2008-04-22T09:15:08-04:00 (New York)
Detail page last modified on 2024-04-05T05:40:27-04:00 (New York)
ISBN/EAN: 1441909613
ISBN - alternate spelling:
1-4419-0961-3, 978-1-4419-0961-9
Alternate spelling and related search-keywords:
Book author: papanikolaou, rado, papan, radojcic, riko
Book title: three dimensional design, integration, whole system design, process design
More/other books that might be very similar to this book
Latest similar book:
9781489981820 Three Dimensional System Integration (Papanikolaou, Antonis|Soudris, Dimitrios|Radojcic, Riko)
< to archive...