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Structural Analysis of Printed Circuit Board Systems: STRUCTURAL ANALYSIS OF PRINTED - Peter A. Engel
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Peter A. Engel:

Structural Analysis of Printed Circuit Board Systems: STRUCTURAL ANALYSIS OF PRINTED - new book

ISBN: 9780387979397

ID: 978038797939

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. Peter A. Engel, Books, Science and Nature, Technology, Electronics, Circuits, Structural Analysis of Printed Circuit Board Systems: STRUCTURAL ANALYSIS OF PRINTED Books>Science and Nature>Technology>Electronics>Circuits, Springer New York

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Structural Analysis of Printed Circuit Board Systems - Engel, Peter A.
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Engel, Peter A.:

Structural Analysis of Printed Circuit Board Systems - used book

ISBN: 9780387979397

ID: 1188274

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. Structural Analysis of Printed Circuit Board Systems Engel, Peter A., Springer

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Structural Analysis of Printed Circuit Board Systems 1st Edition - Peter A. Engel
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Peter A. Engel:
Structural Analysis of Printed Circuit Board Systems 1st Edition - new book

ISBN: 0387979395

ID: 0387979395

Structural Analysis of Printed Circuit Board Systems 1st Edition Author :Peter A. Engel 9780387979397 0387979395, [PU: Springer]

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Structural Analysis of Printed Circuit Board Systems - Peter A. Engel
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Peter A. Engel:
Structural Analysis of Printed Circuit Board Systems - hardcover

ISBN: 9780387979397

Hardback, [PU: Springer-Verlag New York Inc.], Circuits & Components

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Structural Analysis of Printed Circuit Board Systems 1st Edition - Peter A  Engel
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Peter A Engel:
Structural Analysis of Printed Circuit Board Systems 1st Edition - new book

ISBN: 9780387979397

ID: 258818226

NA Structural, Circuit, Springer

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Details of the book
Structural Analysis of Printed Circuit Board Systems
Author:

Engel, Peter A.

Title:

Structural Analysis of Printed Circuit Board Systems

ISBN:

0387979395

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Details of the book - Structural Analysis of Printed Circuit Board Systems


EAN (ISBN-13): 9780387979397
ISBN (ISBN-10): 0387979395
Hardcover
Publishing year: 1993
Publisher: Springer-Verlag GmbH
316 Pages
Weight: 0,637 kg
Language: eng/Englisch

Book in our database since 27.01.2007 10:14:37
Book found last time on 04.10.2016 04:09:03
ISBN/EAN: 0387979395

ISBN - alternate spelling:
0-387-97939-5, 978-0-387-97939-7

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